Cu SiC HTC And LTE Packaging Materials Ceramics

The material is mainly used in heat dissipation substrates, to replace copper substrates, molybdenum-copper alloys, tungsten-copper alloys and part of the application of aluminum-silicon carbide substrates, the material has the characteristics of high thermal conductivity, low expansion, high stiffness, high toughness, etc., compared with the original copper substrate, molybdenum-copper alloy, tungsten-copper alloy substrate weight is lighter, only 1/3-1/2 of the weight of the above-mentioned substrate materials, which meets the requirements of modern production for the requirements of lightness and at the same time meets the requirements of a number of material properties.