Al SiC Semiconductor High Thermal Conductivity Ceramics

1) AlSiC has high thermal conductivity (170~200W/mK), which is ten times that of general packaging materials, which can dissipate the heat generated by the chip in time and improve the reliability and stability of the entire component.

2) AlSiC is a composite material, its thermal expansion coefficient and other properties can be adjusted by changing its composition, adjustable thermal expansion coefficient, AlSiC's thermal expansion coefficient and semiconductor chips and ceramic substrates to achieve a good match, can prevent fatigue failure, and even the power chip can be directly installed on the AlSiC bottom plate.

3) AlSiC is very light, only 1/3 of copper, about the same as aluminum, but the flexural strength is as good as steel. This gives it excellent performance in terms of seismic performance, surpassing the copper baseplate.

4) The specific stiffness of AlSiC is the highest among all electronic materials, 3 times that of aluminum, 5 times that of W-Cu and Kovar, and 25 times that of copper, and AlSiC has better shock resistance than ceramics, so it is the material of choice in harsh environments (large vibrations, such as aerospace, automobiles and other fields).

5) AlSiC can be processed in large quantities, but the processing process depends on the content of silicon carbide, and can be processed with EDM, diamond, laser, etc.

6) AlSiC can be nickel-plated, gold, tin-plated, etc., and the surface can also be anodized.

7) The metallized ceramic substrate can be brazing to the plated AlSiC base plate, and the printed circuit board core can be bonded to AlSiC with binder and resin.

8) AlSiC itself has good air tightness. However, the airtightness after electronic encapsulation with metal or ceramic depends on suitable plating and welding.

9) The physical and mechanical properties of AlSiC are isotropic.