Al SiC Heat Dissipation Packaging Materials Ceramic

1. Compared with the traditional aluminum alloy material, it has stronger thermal conductivity. It is 1.6 times the thermal conductivity of traditional aluminum alloy materials. 2. and the stiffness is higher than that of traditional aluminum alloy materials, which is the highest among all electronic materials. 3. Compared with traditional aluminum alloy materials, the coefficient of thermal expansion is lower, and the matching degree with the chip is better. 4. Compared with other new materials, the cost is more controllable. This product is mainly used in the shell of new energy vehicle lidar, which is mainly used to protect and install radar components. This allows other components to be installed and positioned more accurately, which not only saves material consumption, but also reduces the failure rate of the radar.