Copper diamond

Metal fund corundum composite material is a new type of composite material that combines diamond particles with high thermal conductivity and low expansion coefficient and metal materials such as Al, Cu or Ag with good thermal conductivity through a special process. This high-performance metal-based composite heat dissipation material is mainly used in high-tech technology devices such as high-power insulated gate bipolar transistors (IGBT), microwave, electromagnetic, optoelectronic and other devices, as well as phased array radar, high-energy solid-state lasers and other typical applications in the field of national defense technology